Usage
SikaBond®-T21 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T21 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
Advantages
- ~270% elongation
- Bonds up to 3/4" solid and engineered wood
- Extremely easy to trowel
- Unlimited subfloor moisture vapor protection
- No moisture testing required - a dry to touch substrate is the only requirement
- Crack bridging
- Low odor
- Excellent green grab
- Suitable for common types of wood flooring
- Creates sound reduction layer
- Especially good for problematic woods such as beech and bamboo
- Contains no water
- Eliminates sleepers and plywood over concrete and gypsum substrates
- Permanently elastic - allows planks to expand and contract without damage to the adhesive
- Tenacious bond
Packaging
5 gal. (18.92 L) pail
Color
Light brown